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LSD-150: Processes

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Scribing

Breaking

LSD-150 Specifications

The LSD-150 is ideal for the following processes:

Full Contact Dicing
Applying breaking pressure to a scribed wafer over the surface of the wafer. For use with Detectors, optical filters and light emitting diodes.
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Limited Contact Dicing
Applying breaking pressure to a scribed wafer by a limited set of contact points thereby preserving the integrity of the components. For use with Micro-electromechanical systems (MEM's), MMIC's with Airbridges, and vertical lasers (viscels).
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